Network cooling system II

ABSTRACT

A cooling device with three interdependent chambers. The middle chamber comprises the heart of a control gas use to transfer heat between two opposite side chambers. An opposing chamber with two openings where passing air is cooled by an evaporator whereby looses its heat content. An opposing chamber with two openings where passing air receives heat energy whereby filter heat is extracted by connected vents. The cooling device repeats this cycle.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application Ser.60/546,629, filed Feb. 20, 2004 for “NETWORK COOLING SYSTEM 11” which ishereby incorporated by reference herein.

FIELD OF THE INVENTION

The present invention pertains generally to heat transfer devices andmore particularly to heat transfer rack systems in computing electronicenclosures.

BACKGROUND OF THE INVENTION

The Network Cooling System is an invention intended for the conventionalcooling of rack mounted servers in enclosures. The advent of computershas brought about better productive lives. Today societies around theworld have integrated into their business and personal lives thecomputer. The first years that the personal computer came to mass marketit serves primarily other chores than today's systems. As the years ofthe 90's came into being the quality and prices of these systems furthercatapulted to new heights. The integration of the internet complementedsociety as we have never yet known. The better half of the 90's saw anew horizon for the computer and fast growing communications industry,the network. Because of the internet and technology strives the newmarkets abrupt, and the network became an integral part of the computerphenomena. With the computer in the home and business, the internetmarket, electronic data and information gathering needed physicallocalities to store personal and business data and information. The datacenter became part of dot.com phenomena, corporations around the worldstarted creating data centers, whether one enclosure to hundreds wereintegrated for data and information storage. With these fascinatingmarvels of technology problems that started to plague people in chargeof these centers was the accumulation of heat energy.

With newly develop elongated rectangular rack mounted servers modulesand associated electronics, arise another newly created problem. The useof multiple electrical apparatus in close proximity made heataccumulations and heat densities. Inventors have design mechanicalconditioning of ambient air and integrated air conditioning intocomputers, U.S. Pat. No. 6,493,223 to Intel and U.S. Pat. No. 5,107,398to DEC. This creates problems with humidity and may even hamper allpower to the system. Apart in problem is the integration directly of twodistinct technology fields, is the air conditioning and computerindustry. By integrating directly these two fields, when a technician isout in the field that person has to learn another industry, just to fixan AC problem instead of a computer problem. These problems in part tothe allowable working parameters of servers, hence the phrase “SeverDown.” Two processes become apparent in the cooling of rack andenclosure mounted servers and associated electronics. Fanning and airconditioning became the basis of mechanically conditioning the airaround these systems. Other remedial solutions were the use of openroofs, multiple fans U.S. Pat. No. 6,525,936 to HP and U.S. Pat. No.5,751,549, in servers-computers, design servers U.S. Pat. No. 6,563,704to Sun. Although the referring patents are practical in use they furtherperpetuate the use of electrical power, thereby using more energy, thusmore heat into the system. Countless studies on heat accumulated on rackmounted servers and data center air flow have proven that heat energywill continue to be a problem. The problem is part of today's datacenters and will still be with us for the foreseeable future. Variousinnovations have been brought forth as apparatus or engineering of heatenergy flow.

The data center is an engineered room that houses primarily dataservers. Although the main objective of these large rooms is the housingof rack mounted servers, they do have associated electrical apparatus.They serve as data and information warehouses for personal and business,the associated apparatus that works inside these rooms contribute toheat accumulation. Because in general data centers are block orrectangular in design they are not aerodynamic in any sense, they fallshort of deleting thermal conductivity. At the micro modular level theuse of fans, articulate designs, engineering structures, and varioustypes of cooling adhere to keeping the systems from accumulating heat.Patents sought in combating these problems have resulted in reducing theproblem of thermal conductivity. U.S. Pat. No. 6,144,553 to Sun, U.S.Pat. No. 6,144,213 to Sun, and U.S. Pat. No. 6,462,944 to Macase, combatthe problem of heat by use of fanning in close proximity to the heatsource. The problem of heat still remains, with U.S. Pat. No. 6,144,213to Sun, and U.S. Pat. No. 6,462,944 to Macase, only remove certainamounts of heat energy from source and ambient air, they do not removeheat altogether from source. With U.S. Pat. No. 6,144,553 the heatoverall of a complete electronic system still persists, although heatfrom one source may be remove the system as a whole remains.

Several attempts in integrating technology by mechanical conditioning ofair and architectural structure of data centers have been brought forth.The use of air conditioning is the obvious use of conditioning of airsince it is the only active system that can change ambient temperature.These methods are integrated in data centers, such methodology are inU.S. Pat. No. 6,412,292 to TOC, U.S. Pat. No. 5,467,609 to Liebert, U.S.Pat. No. 5,345,779 to Liebert, and U.S. Pat. No. 5,718,628 to NIT. Allthese patents deal with the integration of force temperature conditionair and data center architecture overlapping. Although, utilitarian infunction these innovations fall short of completely serving an enclosureindividually, that is not every enclosure will have identical networkstructure, thereby not the same thermal accumulation content. Anotherill function is the temperature change of air, because air has differentconstituency in altitudes, and humidity, one end of the data center maynot have the same temperature and constitution at another end. Similarin function are U.S. Pat. No. 6,374,627 to Schumacher-Beckman and U.S.Pat. No. 6,574,104 to HP, in that their objective is the same, but theirapproach is justified by the use of a liquid. They too are practical infunction, but they also do not adhere to individual need of eachenclosure.

Evident in patent protection for the prevailing intellectual propertyvarious tactics in combating thermal accumulation in servers have beensought. They encompass the micro level in the rack/enclosure level, theuse of air conditioning as a whole in data centers, and even theintegration of rack/enclosure design with data center air conditioning.Although all practical and do serve a purpose, their design are eventualtheir faults in completely eliminating the problem, and/or foreseeingthe energy use of today's rack/enclosure of 12 kw to perhaps 25 kw inthe foreseeable future. Another fault of these innovations are that theyare specific to a specific sector in one market, the data center.

SUMMARY OF THE INVENTION

The object of the invention is to cool rack mounted computerized modulesin rack-mounted enclosures. The present invention main objective is tocool servers . . . rack mounted in enclosures with recycle cold air atthe micro-data center level.

According to the invention, the purpose of the Network Cooling System isto cool air in a limited area. More precisely is to air condition andrecycle air repetitiously. As with a limited amount of air, cyclingthrough the system at such close proximity prohibits electronic devicesto increase in temperature in an accelerated comportment.

The advantages of the invention in the micro-cooling level (enclosure)are the cooling of a limited enclose area, the regeneration of cool airrepetitiously in limited enclose area, and the eminent proximity ofcooling network/electronic modules in time, distance, and cubical area.As with conditioning of air by mechanical means, a rule of thumb is theamount of space is imperative in size of cooling system. The amount ofavailable air content to cool is limited to the size of the enclosespace, and not the data center itself; therefore the advantage is thelimited space to cool. Moreover, with a limited space to cool theregeneration of cool air shortens the cycle of cooling to that of alarger system. Moreover, with the limited area the proximity ofrecondition air prevents components in network/electronic modules fromaccelerating in temperature spectrum, therefore the distance cool airmolecules by means of limited cubical area and distance travel in timeprohibits heat regeneration. Conclusively, the above advantages ofsurgically cooling at the micro-cooling level are not limited to minimalspace only.

The advantages of the invention at the macro-cooling level (data center)are the definite cooling of space, surgical cooling of specificnetwork/electronic modules, and the independent assisting cooling. Byproviding conditioning of air by mechanical means at a specific andpredetermined area in a data center administrations are able to specifytemperature requirements of single enclose units. In accordance with thetype and kind of network/electronic modules in an enclosure unit, acontrol unit can have specific temperature settings. The independentsettings assign or determined can narrow in or the required temperatureto a certain type of network/electronic module. Therefore, the coolingwith specification of network/electronic modules allows surgicalcooling, instead of air conditioning a small room in a small business(12 KW to 100 kw), or cools a massive size data center (500 KW to 5 MW).Moreover, the surgical cooling provides the independent assistedcooling, negating the probability of depending on one whole data centerair conditioning plant. The Network Cooling System may assist in coolingor may conclude conditioning of recycle air independently from themacro-cooling level.

In conclusion, further advantages of the invention claim above, theimprovements of the Network Cooling System exist. At the micro-coolinglevel the advantages of the invention over spot cooling are: 1) specificcooling, 2) certain cooling, 3) dependent/independent cooling, 4) rapidcooling, 5) impedance of heat accumulation at the component level, 6)field use (theater of war, commercial use, industrial use). At themacro-cooling level the advantage of the invention over regular coolingare: 1) specific cooling, 2) certain cooling, 3) dependent/independentcooling, 4) time travel of condition air, 5) space travel of conditionair, 6) easy replacement of module if failure, 7) elimination of spotcooling, 8) elimination of fans, 9) elimination of data center multipleAC units, and 10) reduction and elimination of under floor, or/and roofducting, pipes, and structural expensive engineering. Furthermore, theNetwork Cooling System may serve today's systems by providing ample airconditioning of 12 KW of energy to 25 KW of energy consumption useexpected of tomorrows rack mounted enclosures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan illustration of the frontal view.

FIG. 2 is a plan illustration of the thermostat.

FIG. 3 is a plan illustration of the back.

FIG. 4 is a plan illustration of the side.

FIG. 5 a is a plan illustration of the front view of long duct.

FIG. 5 b is a plan illustration of the side view of long duct.

FIG. 6 is a plan illustration of the front view of the short duct.

FIG. 6 is a plan illustration of the side view of the short duct.

FIG. 7 is a plan illustration of the side view, two ducts, andenclosure.

FIG. 8 is a plan illustration of the top view of thermal circuit.

FIG. 9 is an open plan illustration of the condenser duct section.

FIG. 10 a is a plan illustration side view of the evaporator duct upperside.

FIG. 10 a is a plan illustration front view of the evaporator duct.

FIG. 11 is a plan illustration of the evaporator section.

FIG. 12 a is a plan illustration of the top view of the humidityretainer.

FIG. 12 b is a plan illustration of the side view of the humidityretainer.

FIG. 12 c is a plan illustration of the horizontal view of the humidityretainer.

FIG. 13 is a plan illustration of the CCSII in an enclosure.

FIG. 14 is a plan illustration of the CCSII in multiple enclosures.

FIG. 15 is a plan illustration of the data center.

FIG. 16 is a plan illustration of the electrical distribution.

DETAILED DESCRIPTION OF THE INVENTION

The invention is an (1) Air Conditioning Unit, entitled Network CoolingSystem. In FIG. 1 the invention is covered upfront by the (1) airconditioning unit cover, at the front it contains a (2) Thermometer, and(3) On/Off Switch, with and (4) Setting. In the middle section it has a(5) Outflow Grill, which is for venting air for the middle section. Atthe right it has a (6) Thermostat, which is for measuring the ambiencetemperature. At the left it has a (7) Vent that it use for letting theair that is cooled pass to its surroundings, it is assisted by thedesign of the (8) Vent Grill, which blades are turn down. A closer lookat the (6) Thermostat, with its surrounded by (1) Air Conditioning Unitwalls in FIG. 2.

In FIG. 3 the back is illustrated with a (9) Cover that encapsulates thechassis and the (10) Back Panel, which has several (11) Connections,around for proper closer. The back side also has other (12) Inflow VentConnections, which are use for connecting the (13) Inflow Vent, with(26) Condenser Inflow Duct. At a lower level there are another set of(14) Outflow Vent Connections, that are for connecting the (15) OutflowVent, which attaches to the (27) Condenser Outflow Duct. At the right ofthe back side the illustration has a (16) Inflow Grill, which is forsucking the ambient air in. It flows through the (17) Evaporator InflowVent, which is protected by the (18) Grill Connection. The only outsideconnection for electrical power is derive by the (19) Power connection.

In FIG. 4, the illustration depicts the (1) Air Conditioning Unit wouldlook with its (10) Back Panel, its (9) Cover and (16) Inflow Grill. Thisfigure has the Network Cooling System II on angle view showing its (20)Upper Rail with its (21) Rail U-Left Connection and (22) Rail U-RightConnection. Together the (20) Upper Rail and (23) Lower Rail are forplacing the system in an enclosure. Another (23) Lower Rail, with (24)Rail L-Left Connection and (25) Rail L-Right Connection is needed as theweight of the Network Cooling System may require. The Network CoolingSystem design has two attachable ducts. In FIG. 5 a and FIG. 5 b is the(26) Condenser Inflow Duct is intended for use as letting anddistributing air into the condenser chamber. The (26) Condenser InflowDuct, is made up of (26 a) Condenser Outflow Duct—Neck, the (26 b)Condenser Outflow Duct—Connection, the (26 c) Condenser OutflowDuct—Outflow, the (26 d) Condenser Outflow Duct—Angle, and the (26 e)Condenser Outflow Duct—Inflow. In FIG. 6 a and FIG. 6 b is the (27)Condenser Outflow Duct, is made up of the (27 a) Condenser OutflowDuct—Connection, the (27 b) Condenser Outflow Duct—Angle, the (27 c)Condenser Outflow Duct—Intake, the (27 d) Condenser Outflow Duct—Neck,the (27 e) Condenser Outflow Duct—Angle, and the (27 f) CondenserOutflow Duct—Outflow. The (26) Condenser Outflow Duct is forredistributing the exiting air into the ambience, unless special ductingis assign to the system.

In FIG. 7 the back is illustrated with a (9) Cover that encapsulates thechassis and the (10) Back Panel, at the right of the back side theillustration has a (16) Inflow Grill, which is for sucking the ambientair in. The illustration depicts the (1) Air Conditioning Unit wouldlook with its (10) Back Panel, its (9) Cover and (16) Inflow Grill. Thisfigure has the Network Cooling System on angle view showing its (20)Upper Rail with its (21) Rail U-Left Connection and (22) Rail U-RightConnection. Together the (20) Upper Rail and (23) Lower Rail are forplacing the system in an enclosure. Another (23) Lower Rail, with (24)Rail L-Left Connection and (25) Rail L-Right Connection is needed as theweight of the Network Cooling System may require. The Network CoolingSystem design has two attachable ducts. The (26) Condenser Inflow Ductis intended for use as letting and distributing air into the condenserchamber. The (26) Condenser Inflow Duct, is made up of (26 a) CondenserOutflow Duct—Neck, the (26 b) Condenser Outflow Duct—Connection, the (26c) Condenser Outflow Duct—Outflow, the (26 d) Condenser OutflowDuct—Angle, and the (26 e) Condenser Outflow Duct—Inflow. In FIG. 6 the(27) Condenser Outflow Duct, is made up of the (27 a) Condenser OutflowDuct—Connection, the (27 b) Condenser Outflow Duct—Angle, the (27 c)Condenser Outflow Duct—Intake, the (27 d) Condenser Outflow Duct—Neck,the (27 e) Condenser Outflow Duct—Angle, and the (27 f) CondenserOutflow Duct—Outflow. The (26) Condenser Outflow Duct is forredistributing the exiting air into the ambience, unless special ductingis assign to the system. Between the (9) Cover top and the (26)Condenser Inflow Duct is the (28) Duct Support with its (28 a) DuctSupport Connection at the bottom which may be screwed in and the (28 b)Duct Support Holder which attaches to the (26 a) Condenser OutflowDuct—Neck for proper adjustment.

At the heart of the system is in the compressor chamber, in the middle.In FIG. 8 several components make the essential main components of thesystem. The (10) Back Panel serves as wall in the back side for the (1)Air Conditioning Unit. The heart of the system is the (29) Compressor,which is the motor pump that compresses refrigerant for circulation inits loop trajectory. The (30) Compressor Interconnection along with (31)Compressor Holder A and (32) Compressor Holder B, sustain the (29)Compressor in place. Other components that are part of the middlesection is the (33) Electrical Distribution, which is for distributingthe power from the (34) Power Supply. At the refrigerant element the(35) Capillary tube is the component that is vital as the compressor asit limits the flow of refrigerant. The (36) Compressor Inline and the(37) Compressor Outline are the In/Out lines for refrigerant. The (38)Meters Back Panel is the back side for metering and measuring devices.At the right side of the system is the (39) Condenser Inline forentering refrigerant into the (40) Condenser. As the refrigerantcondenses it is part of the cycle that (41) Condenser Fanning is induce,as the refrigerant leaves the (42) Condenser Outline and onto thecompressor again. At the left side is the evaporator chamber whichconsists of the (44) Evaporator that may seat on top of a plat,depending on manufacturing/use specification. A (43) Condensing Platewith a (48) Drain is articulated in FIG. 8, for highly regulatedhumidity environments. The (45) Evaporator Outline is for sending therefrigerant cycle back to the system. The requirement of fanning isimportant in refrigeration as the evaporator chamber consists of a (46)Evaporator In-Fanning and a (47) Evaporator Out-Fanning for pulling andpushing the enclosure air in and out. The (49) Power Connections are forpower distribution in the system and the (50) Components Power is forsequestering electrical power from the electrical outlet.

FIG. 9 illustrates the condenser chamber at the right side the (53)Condenser Inflow show where the incoming air will corn and pass throughthe upper chamber and then redirected by the (54) Airflow Redirectoronto the lower chamber of the (55) Condensing Chamber Divider and sendback outside by the (51) Condenser Outflow Fan and the (52) CondenserOutflow.

In FIG. 9 the (1) Air Conditioning Unit is illustrated on a side, withits (9) Cover surrounding. The diagram shows the (40) Condenser with its(39) Condenser Inline coming from the (35) Capillary tube. It shows the(41) Condenser Fanning that sucks air into the condenser chamber, thatis push onward and downward with the air on an aerodynamic (54) AirflowRedirector that deflects the airflow with the help of a (55) CondensingChamber Divider. As the air passes the lower chamber it is thenperpetuated out by the (51) Condenser Outflow Fan and expel out throughthe (52) Condenser Outflow. The (40) Condenser is aided by the (53)Condenser Inflow which receives the incoming refrigerant which thenpasses it out throughout the coil and onto the (42) Condenser Outline.

FIG. 11 is an illustration (FIG. 9A, FIG. 9B, and FIG. 9C) of the onlyduct in the evaporator chamber. The (56) Evaporator Airflow Duct Panelhereinto also known as panel is use in this chamber for maneuvering theairflow push in and restricting it or compressing it through the (44)Evaporator. The design of the (56) Evaporator Airflow Duct Panel issimple which comes with (56 a) Evaporator Airflow Duct—F Fastener and(56 b) Evaporator Airflow Duct—B Fastener for securing the duct in theevaporator chamber. The (56 c) Evaporator Airflow Duct—Plate makes theupper section which strengthens the interconnection. The (56 d)Evaporator Airflow Duct—Body is the main section that constricts theairflow through the chamber. The (56-1) Evaporator Airflow Duct Upper isthe same duct in the upper section of the evaporator chamber and the(56-2) Evaporator Airflow Duct Bottom is a same duct in the lowersection, placed upside down with the main (56 d) Evaporator AirflowDuct—Body facing the (44) Evaporator.

FIG. 11 illustrates the evaporator chamber, which is the area that coolsand cools again the air content in the enclosure. The air that comes inis force through the (16) Inflow Grill and the (17) Evaporator InflowVent which is connected by the (18) Grill Connection which are part ofthe (10) Back Panel. The air passes in by means of the (46) EvaporatorIn-Fanning. That air that goes in is squeezed by the (56-1) EvaporatorAirflow Duct Upper and the (56-2) Evaporator Airflow Duct Bottom. The(44) Evaporator is cooled by the refrigeration process and therefrigerant that it receives is by the (37) Compressor Outline andleaves through the (45) Evaporator Outline. The air that leaves thechamber is force out by the (47) Evaporator Out-Fanning, to the (7)Evaporator Outflow Vent and redirected by the (8) Vent Grill. The wholesystem is vented together by means of the (9) Cover. The cooling of airmakes humidity condensate therefore the cooling chamber uses the (56-2)Evaporator Airflow Duct Bottom as a drainer. By means of gravity theminute amount of humidity falls into (57) Drains at both ends. Thehumidity goes into the (57 b) Drain Humidity Intake by aid of the (57 c)Drain Humidity Retainer and kept in the (57) Drains at the right end bymeans of the (57 a) Drain Encapsulation. The same design is continue atthe left end as the humidity is taking in by the (57 d) Drain HumidityRetainer and into the (57 e) Drain Humidity Intake and then to the (57f) Drain Out.

In FIG. 12 a, 12 b, and 12 c is an illustration of the (60) HumidityRetainer is shown in three views. The (59) Humidity Intake is for theincoming humidity. For sustaining the (60) Humidity Retainer in properposition in an enclosure the (60) Humidity Retainer comes with a (61)Humidity Rail along with a (62) Right Rail Clip and another (63) LeftRail Clip. In FIG. 13 the (1) Air Conditioning Unit is shown on top ofan enclosure with the (58) Humidity Line connected to (60) HumidityRetainer. FIG. 14 further illustrates the enclosure concept in multipleenclosures as would be the case in a data center. The (1) AirConditioning Unit would be on top with the (58) Humidity Line attach toa (64) Humidity Line A, when not using a (60) Humidity Retainer, underthe (65) Floor a (66) Water Line would be needed. In FIG. 15 the (67)Air Flow of a data center is shown. FIG. 16 is a diagram of theelectrical distribution of the Network Cooling System.

1. A heat exchange system comprising: A center chamber comprising of a compressor located in the rear middle section and arranged between two chambers whereby working as a conductor of heat of one chamber and passing it along to another chamber. A power supply located in the upper middle section whereas electrical wiring is sent to an electrical distributor residing in close proximity. An electrical distributor located in the upper middle section residing in proximity to a power supply whereas electrical wiring is distributed throughout the heat exchange system. A capillary tube located in the middle front of the center chamber whereas it is arrange as a medium for transferring refrigerant; and a meter back panel located at the front end of the chamber use as an indicator of temperature;
 2. A heat exchange system according to claim 1, wherein compressor uses a refrigerant as medium for transferring heat between two opposing chambers;
 3. A heat exchange system according to claim 2, wherein opposing chamber transmits heat and expels it by means of refrigerant in said condenser;
 4. A heat exchange system according to claim 1, wherein power supply transfers electrical energy to electrical distributor;
 5. A heat exchange system according to claim 1, wherein electrical distributor supplies electrical energy to all electrical components;
 6. A heat exchange system according to claim 1, wherein capillary tube functions as a valve;
 7. A heat exchange system comprising: A three chamber heat exchange system whereby the right side chamber is comprised of two level conduits. A right side chamber with upper level conduit allowing flow of air by the use of two fans use to pull air inside. A right side chamber with lower level conduit allowing flow of air by the use of two fans use to push air out. A condenser in the right side chamber at the lower level of the conduit is use to transfer heat energy to passing air;
 8. A heat exchange system according to claim 7, wherein two level conduit navigates force air to pass through a condenser;
 9. A heat exchange system according to claim 7, wherein condenser uses refrigerant as a medium for transferring heat between to opposing chambers;
 10. A heat exchange system according to claim 7, wherein upper level fans draw in force air through the two level conduits;
 11. A heat exchange system according to claim 7, wherein lower level fans force air out through the two level conduits;
 12. A heat exchange system comprising: A three chamber heat exchange system whereby the left side chamber is comprised of a fan at the back end opening whereby a fan vents air into the chamber. Left side chamber has two air compressing ducts that compress air flow in a conduit which restricts vented air to flow through an evaporator in the middle of the chamber. A three chamber heat exchange system whereby the left side chamber is comprised of a fan at the front end whereby a fan vents air out the chamber;
 13. A heat exchange system according to claim 12, wherein fan continuously forcefully vents air into restrictive chamber;
 14. A heat exchange system according to claim 12, wherein chamber is shape in a manner which compresses air into the middle. The chamber is design with the middle section arising and subsiding toward both ends. The placing both chamber panels between said evaporator restricts air flow, thereby accumulating energy from said evaporator as compress air retains more energy than otherwise uncompress air;
 15. A heat exchange system according to claim 12, wherein evaporator receives air from ambient air passing through said vented chamber. The evaporator thereby receives heat energy continuously thereby retaining heat and cooling ambient air as it passes to the front end opening whereby a fan vents air out the chamber;
 16. A heat exchange system according to claim 12, wherein evaporator uses refrigerant to transfer heat to opposing chamber; and
 17. A heat exchange system according to claim 12, wherein fan at the end open vents cooled air repetitiously. 